Database Users

g1 in a sidekick body

would something like this be possible?

jeremycool said:
would something like this be possible?
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Why......?

...G1's are only like 150 dollars on ebay, I don't think so.

protomanez said:
...G1's are only like 150 dollars on ebay, I don't think so.
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.... now that is about the most pointlessly unrelated statement I've ever heard.

lbcoder said:
.... now that is about the most pointlessly unrelated statement I've ever heard.
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SO is yours

Coderedpl said:
SO is yours
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I know you are but what am I?

Children -.-
@Op...
..No.

Anything is possible.
The real question is "is setting out on such an endeavor worth the hassle and potential breakage?"
Frankly, the SK2 was/is *the* perfect form factor for my meat hooks. I would love more modern, android hardware in such a form factor. Will I see it? Definitely not, even though a lead dev for android was a founder of Danger (ever notice how the two keyboards were similar?)
Making the G1's hardware fit into a SK body would be so difficult. Its hardware is not very modular. Only the radio, camera, and gps boards are separate from the main board. The G1 uses metal parts on the body itself as conductors (notice the black-painted metal strips above the battery. The screen is much larger. And the list goes on.
Anyone doing this would have to be an amazing wiz at surface-mount soldering and fabricating new ribbon cables. Again, anything is possible, but that's not the right question.

beartard said:
Anything is possible.
The real question is "is setting out on such an endeavor worth the hassle and potential breakage?"
Frankly, the SK2 was/is *the* perfect form factor for my meat hooks. I would love more modern, android hardware in such a form factor. Will I see it? Definitely not, even though a lead dev for android was a founder of Danger (ever notice how the two keyboards were similar?)
Making the G1's hardware fit into a SK body would be so difficult. Its hardware is not very modular. Only the radio, camera, and gps boards are separate from the main board. The G1 uses metal parts on the body itself as conductors (notice the black-painted metal strips above the battery. The screen is much larger. And the list goes on.
Anyone doing this would have to be an amazing wiz at surface-mount soldering and fabricating new ribbon cables. Again, anything is possible, but that's not the right question.
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thats all i needed to here, i love the g1 but i think the sidekick is the **** for the swivel screen

[Q] front camera?

Hey guys I'm hearing a lot about the new HTC evo slide 4g phone that's gonna come out in January. All the specs are in but supposedly there is no front facing camera which sucks. I wanted to know if you have an android phone that's doesn't have a front facing camera could you install one yourself?

I guess back to taking pictures in the bathroom mirror.

It's a safe bet that if there is truly no front facing camera on this model then no, you could not install one.
Several reasons, coming from someone who has seen the inside of all HTC phones on Sprint.
No already ready circuit board connection for it to be added. It's not exactly even easy to resolder charging ports on these boards but soldering in a connection and then harvesting even say an EVO 1.3 mp camera would not be easy/wise specially since the board would have to already have circuitry and chips already onboard to support it in order to solder a connection for the ribbon to slide into. Even my mad scientist self of a repair tech wouldn't alter my circuit board in this fashion.
No drivers to load the camera(although someone smarter than myself could say that something could be built into a rom or kernel for this) but assuming you printed or had access to print the camera circuitry and solder points onto the board to solder the ribbon connector for the Evo front camera just like a circuit board manufacturer does when designing a board there's no gaurantee that it will 100% work properly not to even mention if the original board design does not have room or a large enough area to put all the supporting circuitry.
3rdly, the front bezel/faceplate would need modifications to let the camera view outside the housing. It would more than likely damage the digitizer creating a hole to support the camera infrastructure.
There are many variables here that really don't make sense in trying to add this modification yourself.
Best to wait for the full specs to see if they will be supporting one from the get go. Our 4g phones kind of demand this sort of thing anyway so I'm sure that whatever early schematics we see that HTC designs Sprint Execs who work with the vendors to create a product can easily ask that it be added to the manufacturing process beforehand so its highly probable it will already come with one.
It seems to be on designers minds these days going forward as something the 4G phones easily can support since the network can easily support the function of video conferencing.
Sorry if I got long winded or too technical, I tend to get that way with my customers too.

It's possible
http://phandroid.com/2010/10/01/do-...cing-camera-on-your-samsung-galaxy-s-vibrant/
Sent from my PC36100 using XDA App

Only because the Galaxy S boards are pretty much the same in each version for each different carrier minus the addition of the slider on the Epic.
There's no telling whether or not the EVO shift is going to have the same circuit board as the EVO 4G.
And if it does, Sprint and HTC would more than likely make the decision to go ahead and put that camera in there.
So, it's only possible if they decided to use the same board, and not go with ffc and leave the connector on the board open.

[Q] Hardware CPU

Possiblу is replacement of procesor QUALCOMM QSD8250 on HTC HD2 with dual core 1.5GHz procesor similar with mainboard and other components?I mean CPU of another smartphone.Thanks in adviance

I don't even know if its possible, but there would be so many problems caused by doing that that it really wouldn't be worth it.
Sent from my NexusHD2 using xda app-developers app

It's probably not possible.

Too long a response: what I've seen inside the Leo.
I have the remains of 3 disassembled HTC HD2 units in the fight lab (aka storage).
I will warn that these units are never able to be put back together exactly perfect as they were initially. This is because they are assembled like thin layers of stickers stuck on top of each other you need to peel apart. There are layers of copper shielding, plastic, thin metal, etc. all sandwiched together with adhesive. I've taken apart damn near everything I can, (a personality trait and/or symptom of a disorder, a gift and a curse) and I can say that disassembling an iPhone is cake compared to peeling apart HD2s which are a curse.
So, upon peeling it apart, I encountered different CPU cooling techniques on the different units: yellow thermal compound on one, a thick red/orange thermal pad on the second, and a plastic piece stuck with a mystery compound (possibly even glue) on the 3rd. A faster chip will likely be even hotter.
Look into "reballing" when it comes to soldered cpu replacement. The complexities of the physical replacement are significant but the routing of correct functionality from the alien processor are what makes it a much more difficult project, but nothing is impossible.
One would have to have manufacturer schematics of the board, insider details of chips/other components if functionality is to be had even IF the physical removal and replacement of the processor was achieved. The physical install of a faster clocked chip I think we will see done successfully by someone, but the function of the hardware may be forever impossible unless what I believe is closed/unreleased code/info becomes public. If any device were to have it's complete wealth of detailed info released from company insiders/Dark Force Teams/Chinese anons/crafty work, et al, I'd bet it very well would be the Leo. (We can dream).
To be clear, I'm no chip alchemist at all, I'm just sharing what I've seen and been told by some professionals who know at least a little on what I generalize as computer hardware engineering. Having extensively researched (aka wasted too much of my life on) and even managed to discuss with some HP technicians about a tablet CPU upgrade of a soldered Dothan board, I learned that even if the CPU is successfully replaced (& it doesn't explode) it's more than likely the timings of the board may wind up very effed up. Being uncharted territory, there is no way to find out but to try. I appreciate it if I helped or something interesting came from my ramblings, I think clicking thanks helps me or something. Keep fighting and don't take apart your HD2 if you don't have another one handy!

If i change motherboard(cpu,ram and others) and replace them with another motherboard(with cpu,ram and others) but but outside HD2 is unchanged,with same display and buttons!This is a posable?Please tell me?

Drake Sanderson said:
If i change motherboard(cpu,ram and others) and replace them with another motherboard(with cpu,ram and others) but but outside HD2 is unchanged,with same display and buttons!This is a posable?Please tell me?
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er, replace them with what? a quad core and 4gb from your pc? and why? are you skilled in microsoldering and chip reprogramming?
how much space is inside your phone and what do you really think the chances are of replacing anything?
did you not read the post above yours by ComputerFight. he has seen the inside of an HD2 and lived to tell the tale
i would usually answer 'anything is possible' but i think this one has to be a no

Even if it was possible, i don't understand what would you acomplish with it?
HD2 is legend because of it's wide variety of OSs, roms etc, not because of its hardware.. at least not anymore.
I would rather buy an new phone or used HD2 if i feel like playing around with flashing different operating systems.

If you do even manage to successfully solder and re-wire new hardware onto the HD2, it wouldn't be usable because there are no drivers for them. Someone who have to build hardware drivers from scratch or port them from other phones then every HD2 Rom would have to be re-done to work with the new hardware. I'm no tech expert but I hardware isn't the main problem, it's software. It would be cool if we got tegra 3 and more ram on the HD2 though, that would give the HD2 2-3 more years in a chance to run future roms.

Still another smartphone to make the appearance as being an HTC HD2?Do you think it possible?

Would you recommend a dual core cpu to pull out another smartphone and puts htc hd2 (as htc sensation xl)?

Drake Sanderson said:
Would you recommend a dual core cpu to pull out another smartphone and puts htc hd2 (as htc sensation xl)?
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Oh my god....

HTC One Tear down

Looks like it is totally unrepairable, even by HTC
http://www.ifixit.com/Teardown/HTC+One+Teardown/13494/1

this simply will build even more admiration for the device
i want it even more now :laugh:
Also i think they have missed the point of simply removing the speaker cover to start the process
Simply put, it's crazy...
despite the score, the article is full of praise for the craftsmanship!
HTC has said over and over that they wanted to create a seamless product, and the absence of any exterior screws is a testament to that.
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Our diligent spudgering appears to have permanently mangled the plastic bezel surrounding the aluminum case. It's possible that prying at a snail's pace while applying heat could minimize this damage, but we're not too hopeful. This phone was not made with open-ability in mind.
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The motherboard of the HTC One is pretty much encapsulated within copper shielding. Two flat pieces of copper adorn each side of the motherboard.
Here's the thing about copper shielding. It dissipates heat and provides electrical grounding. However, copper shielding is a pain to deal with during reassembly—kind of like trying to straighten out aluminum foil once it's been crinkled.
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The HTC One's 1080P, 468 ppi resolution rivals today's HDTVs and the 10.6" Surface Pro, but in a 4.7" size.
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There is no respite for the weary—even the rear camera is coated in copper shielding.
This is the HTC UltraPixel camera, a f/2.0 aperture, 28 mm lens unit with a dedicated HTC ImageChip™ 2.
It is not surprising to hear HTC bragging about camera specs, as their apparent Siri counter-marketing is Zoe, your personal photo assistant.
Manufacturing such a small camera that can do so much is a hefty task, and a shortage of these units is a big reason why HTC has had to delay the official launch.
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The daughterboard remains, but there is still a mystery left unsolved.
No phone operates without antennas, and antennas don't transmit signals well through metal walls. Considering that this daughterboard is on the receiving end of the motherboard's antenna cables and sits directly under the plastic bezel at the top of the phone, we're thinking it has something to do with wireless signals.
See those three spring contacts along the top of the board? They meet the rear case in an area obscured by the plastic bezel. If we had to guess, that's where HTC put the antennas.
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HTC One Repairability Score: One out of 10 (10 is easiest to repair)
Very, very difficult (possibly impossible?) to open the device without damaging the rear case. This makes every component extremely difficult to replace.
The battery is buried beneath the motherboard and adhered to the midframe, hindering its replacement.
The display assembly cannot be replaced without removing the rear case—this will make the most common repair, a damaged screen, nearly impossible.
Copper shielding on many components is difficult to remove and replace.
Solid external construction improves durability.
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---------- Post added at 08:51 PM ---------- Previous post was at 08:32 PM ----------
Engadget: http://www.engadget.com/2013/03/28/ifixit-breaks-open-an-htc-one/
Slashgear: http://www.slashgear.com/htc-one-teardown-proves-durability-a-top-priority-28275687/
yup still positive
If you were looking for the HTC One to be a device you were easily able to take apart for inner-bits replacement, you might not be all that pleased with the report appearing today. On the other hand, if you love it when iFixit gives a big shout out to the device you’re looking to buy for its immense durability, the HTC One might be the phone for you. It’s not going to be a device you’ll be popping open on accident, that’s for sure.
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With the release of the HTC One, the manufacturer has bet a whole lot on the hardware as a proving point in their history. With this release, the company known as HTC says that they’ve done the best they’re able at the moment – this is the HTC One, and it’s named that for a reason. According to iFixit, this device is just about the most difficult smartphone to tear apart they’ve come across – but that’s not all bad news for you if you’re a general consumer.
The HTC One does not have a removable battery, nor is it able to take a microSD card. It’s got a body that’s made from one solid block of machined aluminum with a lovely pane of reinforced glass up front. A collection of awesomely odd bits and pieces can be found in the teardown, including this fun selection:
• Elpida BA164B1PF 2 GB DDR2 RAM
• Samsung KLMBG4GE2A 32 GB NAND flash memory
• Synaptics S32028 chip
• Cable for display labeled with DATE: 2012.11.30
That last bit proves that there’ve been bits and pieces of this device ready to rock for several months now – the back casing of the device can be seen to carry the date 2013/02/15, indicating that some of the parts have been added as recently as the middle of February (for this unit, anyway.)
Have a peek at the timeline we’ve got below of fabulous HTC One bits and pieces, and don’t forget to check out our full HTC One review as well. This is a device that’s set to either be a skyrocket-ready spaceship to the moon for HTC, or one of the biggest disappointments for the company in their history – if it doesn’t sell, that is. Have a peek at our full run-down now!
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Considering its sleek, primarily aluminum construction we never thought the HTC One was going be easy to crack open.
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hamdir said:
If you really intend negativity from your post
i dont think you have succeeded, this simply will build even more admiration for the device
!
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Not at all, simply a statement of fact. If you send 'one' to HTC for a warranty repair it looks likely that you will get a new unit back.

packetlos said:
Not at all, simply a statement of fact. If you send 'one' to HTC for a warranty repair it looks likely that you will get a new unit back.
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yes jsut crazy but again
i feel they were too intimidated and simply failed to figure out how to open it
ie: speaker covers

hamdir said:
If you really intend negativity from your post
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The negativity is implied based on a one out of 10 repairability score. How much do you think it's going to cost to repair/replace a display out of warranty? Or replace a unibody damaged in a fall? Ifixit could give a crap about one manufacturer over another so they have no bias in their reporting. What they are reporting is that the One will be a very expensive phone to repair based on its design. No matter how much the following is true.
the article is full of praise for the craftsmanship!
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Meanwhile, what do you think the sides are made of based on this? It looks like some type of trim applied to the unibodyfor it to bend that way.

we already know the device can be opened from its speaker, so i dont know what were they smoking
and i didnt say iFixit is implying negativity, i was asking the poster if this is his intention, relax lol
have a look at the drop down test it will answer few questions
if iFixit is true and its not a fixable device, than HTC intend not to fix them at all and simply replace it
but like i said i think it has a way to open form the covers

hamdir said:
So really i dont know what to say? are you in full intentions to simply spoil the fun of HTC owners?
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Huh? Kind of shooting the messenger, no? Since the One's unibody was first shown off I've been curious about how it's held together because it's a very unsual design no matter who built it. Drop tests and tear downs give a lot of insight in to questions I'm sure I'm not alone in having. Sorry if the answer's aren't "fun" and I have nothing to do with the outcome of any tests the One or any other device are subjected to. I'd be just as shocked if another brand's device had a repairibility score of "1." And as I said in another thread, devices get the forum's they deserve. If once in people's hands the One is a "happy" device that's what the forum will reflect. After a year of sticking your fingers in the holes in the dyke that was the One X forum you should know that by now.
And "aluminum" as a material isn't what determines repairibility it's engineering and design focused on facilitating it to keep repair costs down. Here's how the "other" aluminum phone did.

BarryH_GEG said:
If once in people's hands the One is a "happy" device that's what the forum will reflect. After a year of sticking your fingers in the holes in the dyke that was the One X forum you should know that by now.]
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One X owners are happy, go ask in their thread
the one x been flying and great device every since the software issues were fixed with the 2.17 update and defects cleared TWO MONTHS after release
you are in fact extremely patronizing and insulting
comparing to the iPhone is useless if the device like claimed by iFixit was not intended to be repaired!

hamdir, do u have any idea how to remove the speaker covers? ifixit looked like they butchered the phone with an axe, there must be another way to have a simpler break down
BTW ifixit said it was all "A"s after the back was removed, meaning removing the backplate was the hardest part

jngtt said:
hamdir, do u have any idea how to remove the speaker covers? ifixit looked like they butchered the phone with an axe, there must be another way to have a simpler break down
BTW ifixit said it was all "A"s after the back was removed, meaning removing the backplate was the hardest part
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yes the speaker covers are currently falling out on their own in defected units and in drop test its flying easily, so really they didnt need to butcher it like this
they acted under the impression that the entire device is uni body and hence started with the screen, if you notice all the way through the tear down they never removed the speakers
its all hilarious really

Yea i noticed them saying the zero gap phone had a gap when they removed the screen. As far as I am aware the zero gap is to do with the back of the phone and the plastic surround after watching htc's video on how it's built.
Sent from my HTC One using xda app-developers app

BarryH_GEG said:
The negativity is implied based on a one out of 10 repairability score. How much do you think it's going to cost to repair/replace a display out of warranty? Or replace a unibody damaged in a fall? Ifixit could give a crap about one manufacturer over another so they have no bias in their reporting. What they are reporting is that the One will be a very expensive phone to repair based on its design. No matter how much the following is true.
Meanwhile, what do you think the sides are made of based on this? It looks like some type of trim applied to the unibodyfor it to bend that way.
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The plastic sides look similar to pvc cladding without the "gel"? Coat, ie look at the endgrain of the cladding strip.

Chipworks didn't seem to have near as much trouble with their teardown.
http://www.chipworks.com/blog/recentteardowns/2013/03/28/inside-the-htc-one/

delete

Hamdir: Do you have the proper disassembly guide then? As it is, this will be impossible to take apart to replace the battery or screen.

jngtt said:
BTW ifixit said it was all "A"s after the back was removed, meaning removing the backplate was the hardest part
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If you look at the pictures for that quote, you will see that they are talking about the QC from the factory who had written all over the interior of the case. Your meaning, while probably true, isn't what they meant.

BarryH_GEG said:
The negativity is implied based on a one out of 10 repairability score. How much do you think it's going to cost to repair/replace a display out of warranty? Or replace a unibody damaged in a fall? Ifixit could give a crap about one manufacturer over another so they have no bias in their reporting. What they are reporting is that the One will be a very expensive phone to repair based on its design. No matter how much the following is true.
Meanwhile, what do you think the sides are made of based on this? It looks like some type of trim applied to the unibodyfor it to bend that way.
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I like how HTC has tried to make the One more sturdy for customers. However, I doubted how the production can make a large amount of aluminum body, and now I'm sure it's even harder with this kind of assembling. Not very good idea for production

Gotta think about this one
hung2900 said:
I like how HTC has tried to make the One more sturdy for customers. However, I doubted how the production can make a large amount of aluminum body, and now I'm sure it's even harder with this kind of assembling. Not very good idea for production
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Chipworks didn't say anything about the level of difficulty with dissembling. Nothing I saw anyways. This puts a little doubt in my mind looking down the road a couple of years. In 2-3 years it will be time to replace the battery...then what? WE HAVE SOME GREAT LOCAL REPAIR GUYS, BUT WILL IT BE POSSIBLE TO REPLACE THE BATTERY WITHOUT WRECKING THE PHONE? Good question huh? How much would a 2-3 year old HTC ONE be worth, if anyone were to consider buying a used ONE?
My current phone, an ATRIX 4G, now 3 years old, had a couple of problems last year. The volume rocker mechanism broke and had to be replaced. I'm also not on the original battery. I have 3 spare batteries just in case. Carrying around a small 10,000mah charger from Ebay
(for $24.95) is an option. But really if something goes wrong with the phone (out of warranty) you may just have to buy a new phone. This means that you cannot count on any trade in value on the phone. If you can live with that, OK. But you still need insurance in case there is a problem along the way.
Just food for thought guys.

This is great! This confirmed my speculation that HTC is just using a single modem for Asia, EU and all other variants of the HTC One! Thanks to the MDM9215M chipset it has!
What it means is
LTE:
EU: 800/1800/2600 MHz
US (AT&T): 700/850/AWS/1900 MHz
US (TMO): 700/AWS MHz
US (Sprint): 1900 MHz
Asia: 1800/2600 Mhz
is only 1 single phone.
So yeah we could cross flash basebands to unlock certain bands. US carriers could purchase the HTC One from Europe then when S-Off is already available they could just flash a baseband of the US model then they should have LTE instantly. Or better yet it's already a world phone by default. Since they are using the same modem chipset with the likes of Xperia Z & ZL.

Lol, to me that only means "don't try it at home":good:

Nexus 5x 32GB 4GB ram + 3400mAh battery + heatsink mod

Needed an inexpensive spare phone. Picked up a Nexus 5x 16GB for less than USD50, with problems (Unable to turn on, only red LED when trying to charge) so starting a project to revive it.
Stumbled across this thread.
Bit the bullet and bought the oudini UNLOCKED H791 32GB Mainboard with the 4GB RAM and a Da Da Xiong 3400mAh Battery to go with it.
Planning to do the copper heatsink mod too.
Was thinking of expanding on the idea of the copper heatsink mod with this Experimental "home-made" modding for heat dissipation mod. Aluminum foil was used along with liquid metal thermal compound in that thread. Not a good idea as liquid metal with aluminum is a recipe for disaster. I was thinking of using copper foil instead. Haven't decided on whether to use thermal paste or liquid metal. Also thinking of creating a bigger surface footprint for the "heat dissipation pipe" like the attached picture.
Your thoughts?
Will update once all parts arrive and I begin assembling. :fingers-crossed:
Attached Thumbnails

Good luck with that. Sounds like fun.
With that mainboard, is there any guarantee it won't start bootlooping a few months down the road?

Good to see somebody else dumping money into such a hobby
Aside from my daily driver 5X, I have another one now at the shop for a reballing job - kind of a long story, outcome still unknown
I don't think that whole 'heat pipe' situation is needed, you are going to be fine just with the copper pad.
I've been running it for a few days now and honestly it's more than enough. You won't get anymore performance out of this chip unless you go sub zero cooling or something.
Seriously, having it run at 30 to 40°C on daily normal usage and 40 to 50 in games or other intensive tasks is just fine.
Thermal throttling is also kept to a minimum, especially with the non-stock thermal configs.
That battery capacity is jank, you can't physically fit that much juice into that space.
The best battery you can get your hands on is a LG *allegedly* original unit from Amazon sold directly by LG. Other than that, you are always going to end up with some knock off that gives you, at best, the same battery life as a 3 year old original one.
Good luck with all this then.
But you'll probably ditch it all in a year's time for a Pixel, when you'll want that fresh Android. That's going to be my story, anyway.

AsItLies said:
Good luck with that. Sounds like fun.
With that mainboard, is there any guarantee it won't start bootlooping a few months down the road?
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I guess there are no guarantees... My understanding is, this bootloop is caused by hardware problem with solder connections between the board, RAM and CPU. The RAM is packed with the CPU together on the top.
This main board has had a new RAM/CPU soldered on. So unless it was a shoddy job, it should all work. Now, under heavy load, heat builds, and when it gets too hot, there is a possibility of the solder connections giving problems again. Which is why I thought of doing the copper heatsink mods to reduce the chances of it happening. Also, with the 4GB of RAM, I am hoping it will have less stress on both CPU and RAM, which in turn will generate less heat, thus reducing the chances of the problems with the solder connections.
All this is just theoretical. I guess I have to build it and see how it goes. :fingers-crossed:

RO.maniac said:
Good to see somebody else dumping money into such a hobby
Aside from my daily driver 5X, I have another one now at the shop for a reballing job - kind of a long story, outcome still unknown
I don't think that whole 'heat pipe' situation is needed, you are going to be fine just with the copper pad.
I've been running it for a few days now and honestly it's more than enough. You won't get anymore performance out of this chip unless you go sub zero cooling or something.
Seriously, having it run at 30 to 40°C on daily normal usage and 40 to 50 in games or other intensive tasks is just fine.
Thermal throttling is also kept to a minimum, especially with the non-stock thermal configs.
That battery capacity is jank, you can't physically fit that much juice into that space.
The best battery you can get your hands on is a LG *allegedly* original unit from Amazon sold directly by LG. Other than that, you are always going to end up with some knock off that gives you, at best, the same battery life as a 3 year old original one.
Good luck with all this then.
But you'll probably ditch it all in a year's time for a Pixel, when you'll want that fresh Android. That's going to be my story, anyway.
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I don’t really game on phones but where I live, temperatures and humidity are quite high. Not looking for crazy performance, just hoping the phone stays cool and will last a while.
As for that battery, we’ll see. No harm trying after all. A guy on reddit bought one and said it does last longer than the original. If it sucks, I’ll just revert back to the original one.
This is just a small hobby/project, who knows how long I’ll use it. I actually already have a Pixel 2 XL. As I’ve mentioned, this is just a spare.

I also bought one of the 4GB boards (two actually) and replaced a dead N5X from ebay with the upgraded one. Works flawlessly, will post screenshots of the system info of 4GB RAM soon when I have my phone sorted.
I'm curious about that battery though - is it legit 3400MaH?
This is the 4GB board I bought, same as you. My first two didn't make it past chinese customs but he sent another two and they made it fine. https://www.aliexpress.com/item/oud...for-LG-H791-32GB-Motherboard/32846103543.html

AsItLies said:
Good luck with that. Sounds like fun.
With that mainboard, is there any guarantee it won't start bootlooping a few months down the road?
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At the moment, no one reported bootloops on Nexus 5X with 4GB Ram. We will see in the future.

4GB board installed, just installing apps and setting it up etc. Feels snappier anyway. When installing ElementalX kernel, I set the read-ahead buffer from 512kb to 1024kb to adjust for the increased RAM.

Soon I will order one Motherboard. If my 5X will have bootloop again.

paradoxiumwind said:
I'm curious about that battery though - is it legit 3400MaH?
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No idea but on the sellers ad, they say they use a EBC-A10H machine to test their batteries for the desired result. Also, there are a couple of brands besides the Da Da Xiong one that I bought. There's HSABAT, LOSONCOER and IBITION.
On reddit k3v1ng1994 says ;-
"Just wanted to update you on the extended battery.
I finally had it delivered a couple of days ago. I can confirm that the battery does so far last longer than the OEM battery- I just don't know exactly how much by.
The biggest issue is the battery has thrown my phone out of calibration. No longer can I see what battery percent I'm on (it always stays on 50%), and the screen on time isn't resetting when I put my phone on charge. I've tried many ways to try and recalibrate the battery, with no luck.
I would say it's not worth getting for this very reason. I'd rather be able to tell how much battery I have left, rather than have a longer battery life. But you might be interested in giving it a go, especially if you're rooted since you can take additional measures to calibrate the battery."
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I guess there is an issue with calibration but I think should be an easy fix with a flash of stock images (or factory wipe) and batterystats.bin will be removed in /data/system... Should be calibrated after that. Not sure which brand he bought though. Who knows. Will try and see how it goes.

Got a notification, my items have been shipped!
Main board should arrive by the 2018-03-18 but the battery says 2018-04-08 . I've ordered stuff from China recently and they usually arrive before their estimates. Hopefully they get shipped out of the country before their Chinese New Year holidays. Then it's up to my country to deliver the goods.
Took apart the phone today and tried the "heating" method fix but it didn't work. I got as far as getting "Google" to appear on the screen then it gets stuck there.
Anyway, looking at the heatsink/"heat pipe" mods, I'll probably stick to thermal paste instead of liquid metal. Liquid metal is corrosive. Even with copper the metal ions will migrate into the copper metal, gradually creating a copper-gallium alloy that is grey-silverish in color. Which is why people think it's drying up. It's actually the copper absorbing the liquid metal.
Looking at what PC CPU heatsink are like these days, the contact point is usually copper, followed by aluminum fins for faster heat dissipation. Why not just follow that recipe. :silly:
So, looks like the copper foil I ordered won't be of any use now :laugh:.

Really don't think a heatsink mod is needed, in my old phone I used a 0.1mm(or 0.2mm I forgot) copper shim over where the CPU is, stuck it on with thermal paste, didn't make much difference in cpu temp.

paradoxiumwind said:
Really don't think a heatsink mod is needed, in my old phone I used a 0.1mm(or 0.2mm I forgot) copper shim over where the CPU is, stuck it on with thermal paste, didn't make much difference in cpu temp.
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A .1 or .2 mm shim won't indeed change anything, it's way too thin for the chip to be in contact with the chassis. Especially if you don't remove the factory yellow pad and the thin foil from the chip shield.
With a .8 or .9 mm copper pad (can't tell for sure, I sanded down a 1mm pad) I can guarantee that you'll notice the temp difference, the throttling is almost gone.
It also depends on what thermal paste you use and how much of it.
Also to everybody wondering why the bootloop issue occures, here's a few things:
The 808 and 810 were the first x64 chips Qualcomm came up with as a response to Apple's. So you can imagine they aren't exactly well thought out, especially in the long run. You can do a bit of research to see how they just janked together some ARM cortexes, slammed a GPU in there and called it a day. Samsung even ditched the 810 from the S6 and used in-house silicon - I think we can safely assume Samsung knows its hw game.
The stock thermal config and kernel are absolute garbage and don't help at all with the thermal throttling that keeps the little cluster pinned at 1440Mhz and the big one off, anytime the package is above 46°C - that's most of the time. Now you tell me how easy that is on the hw.
These design flaws coupled with possibly bad soldering led to our problems. Even though it's hard to imagine that so many boards made it out of the production line with bad soldering since that's a mostly automated and very tidy job, leaving little to mistake.

RO.maniac said:
A .1 or .2 mm shim won't indeed change anything, it's way too thin for the chip to be in contact with the chassis. Especially if you don't remove the factory yellow pad and the thin foil from the chip shield.
With a .8 or .9 mm copper pad (can't tell for sure, I sanded down a 1mm pad) I can guarantee that you'll notice the temp difference, the throttling is almost gone.
It also depends on what thermal paste you use and how much of it.
Also to everybody wondering why the bootloop issue occures, here's a few things:
The 808 and 810 were the first x64 chips Qualcomm came up with as a response to Apple's. So you can imagine they aren't exactly well thought out, especially in the long run. You can do a bit of research to see how they just janked together some ARM cortexes, slammed a GPU in there and called it a day. Samsung even ditched the 810 from the S6 and used in-house silicon - I think we can safely assume Samsung knows its hw game.
The stock thermal config and kernel are absolute garbage and don't help at all with the thermal throttling that keeps the little cluster pinned at 1440Mhz and the big one off, anytime the package is above 46°C - that's most of the time. Now you tell me how easy that is on the hw.
These design flaws coupled with possibly bad soldering led to our problems. Even though it's hard to imagine that so many boards made it out of the production line with bad soldering since that's a mostly automated and very tidy job, leaving little to mistake.
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I don't want to go OT, but understanding some things may help "solve" the heat / bootloop problem in non-bootlooping N5X. In stock kernel, through ExKernelManager, I've seen CPU at 96º C when taking photos with HDR+ With Jolla kernel and the big off, CPU hardly reaches 60º C. If soldering is not "the problem", an "accurate" kernel configuration will be enough to avoid the bootloop? Sorry if I misunderstood your explanation or if I ask something stupid. I know nothing about this, but I would love to learn something. Thanks!

CLPose said:
I don't want to go OT, but understanding some things may help "solve" the heat / bootloop problem in non-bootlooping N5X. In stock kernel, through ExKernelManager, I've seen CPU at 96º C when taking photos with HDR+ With Jolla kernel and the big off, CPU hardly reaches 60º C. If soldering is not "the problem", an "accurate" kernel configuration will be enough to avoid the bootloop? Sorry if I misunderstood your explanation or if I ask something stupid. I know nothing about this, but I would love to learn something. Thanks!
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All I'm saying is pure speculation, the web is filled with people talking bs about 808 and 810.
Also, Qualcomm, LG or Google never settled this with actual honest facts.
Another fact is that some Huawei made Nexus 6P devices bootlooped as well, so you can see how one could easily think that the root problem is the architecture itself of that generation of SoCs.
On the other hand, I can make an 'educated guess' about how a cooler running package prolongs its life and puts less stress on the 'allegedly' weak soldering.
So I think it's safe to assume that running a custom kernel and thermal config, along with other tweaks like the heatsink, will dramatically increase the life of your 5X.

Hello friends first forgive the translator's mistakes. I already knew this topic before but did not know that the motherboard had already been sold already modified.
My thanks to @LeonF for providing the link of the sale of the motherboard with 4GB of RAM.
I already have a functional 5x nexus, but I bought another today with the burned motherboard per US $40.00. Then I bought the motherboard per US $132.05 5% off.
Unfortunately I live in Brazil, the customs (IRS) here are horrible, it will certainly take up to 70 days for me to receive the product, as soon as arrive i come to post my opinion here... on a battery 3400mAh do not think it's good.

I have noticed with my 4gig ram board, my battery usage is really good. same battery. ordered two of those 3400mah ones though, but somehow more ram = better battery time

Copper shims arrived today. They're 15 x 15 x 0.8 mm. Took the phone apart, did a mock of the copper shim then cleaned off the yellow thermal pad...

So @Mortihead found a service that will replace your emmc chip to 32GB, 64GB or 128GB and mentioned I should try.
Mortihead said:
Taobao service now can change internal storage for 32/64/128GB in Nexus 5x
https://item.taobao.com/item.htm?spm=a211ha.10565794.0.0.e9dd404sdwVlg&id=549749619850&toSite=main
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I got in touch with them and found out (as best as I can understand the WeChat translator) that the 128GB chips have been out of stock but they still have the 64GB ones and it will cost RMB280 to do it.
I found this chart from @ikfe from this thread of the part numbers...
ikfe said:
Sure, but my idea is not an occasional adaptater but a real memory extend like this thread : http://forum.xda-developers.com/google-nexus-5/help/nexus-5-64gb-t3350533
I'm confused with 2 ideas :
-Add an SDCard slot (can be cool)
-Extend memory to 64 or 128gb (my advice SDCard still better)
On the iFixit Teardown guide, it says it's a Toshiba THGBMFG7C2LBAIL (16gb variant) chip.
And in the Toshiba catalog, like u can see downside, all chips seems to be the same type (P-WFBGA153).
The problem is the size of the chip. Upgrade can be easily done to 32GB (N5X Variant), or to 64 and 128 gb, up to 0,4mm difference.
Searched a bit on the web and finded some chips:
64GB Variant:
https://www.rutronik24.com/product/toshiba/thgbmhg9c4lbair/7782539.html
http://fr.aliexpress.com/item/THGBMHG9C4LBAIR-VFBGA-153-eMMC5-1-64GB-Flash-Memory/32653487163.html
128GB Variant:
http://fr.aliexpress.com/item/THGBMHT0C8LBAIG-TFBGA-153-eMMC5-1-128GB-Flash-Memory/32653124263.html
http://www.alibaba.com/trade/search?fsb=y&IndexArea=product_en&CatId=&SearchText=THGBMHT0C8LBAIG (Ask seller)
The only problem i see is like i said above, the chip size grew up to 0,4mm, so is it possible to do it without get an curved nexus?
Any ideas where and how is possible to put an SD Reader?
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Searched for the 128GB chips and found this for USD$35. I can go as far as fitting the new 128GB chip but I have no idea how to proceed after that. Reading the thread about @KApetz2 and how he fitted a 64GB eMMC to his Nexus 5 you have to fix the partition tables to support the larger capacity storage or it wouldn’t recognize the upgrade. If someone can point me in the right direction, I might try it out.