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So, after taking this apart and removing the thermal pad on the t20... applying arctic silver gel/paste, i think temps are averaging higher.. so yeah, hold off on doing that one..
Edit - it couldve been the loops of 1.646ghz tests i was doing
So... you dismantled your TF and applied a CPU thermal paste in there? Wow, you must be really gunning for higher clocks.
maybe the gap between the two surfaces aren't tight enough for thermal paste to be effective
nickSolo said:
maybe the gap between the two surfaces aren't tight enough for thermal paste to be effective
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Click to collapse
And not enough heatsink area to dissipate the heat.
nickSolo said:
maybe the gap between the two surfaces aren't tight enough for thermal paste to be effective
Click to expand...
Click to collapse
I'm thinking this.. I'll probably wedge in an aluminum shim.. cut from 'sheet metal'.. I think thats .020"..
Heat is being dissipated more so from the screen (thats bad, as the front of the screen is the underside of the chip).. It means that the 'heatsink', which is a large metal piece, is not getting most of the heat. I'm not worried about the heat tho.. as I have provisions to downclock at ~43-44.. which is ultra conservative.. If only the back of this thing weren't plastic... it'd be a killer overclocker..
I'll post pics..
http://home.comcast.net/~ibladesi/IMG_0023.JPG
http://home.comcast.net/~ibladesi/IMG_0025.JPG
http://home.comcast.net/~ibladesi/IMG_0027.JPG
http://home.comcast.net/~ibladesi/IMG_0028.JPG
btw.. this thing came pre-fingerprinted. heh
that looks like a lot of thermal paste for such a tiny chip
Freelancerx said:
that looks like a lot of thermal paste for such a tiny chip
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Click to collapse
thank you. Thats very nice of you to say to me.
Freelancerx said:
that looks like a lot of thermal paste for such a tiny chip
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Click to collapse
It is too much. The paste is intended to only fill in the what does not contact the sink not to insulate the sink from the chip. The more surface area of the chip that contacts the sink, the better.
levenite said:
It is too much. The paste is intended to only fill in the what does not contact the sink not to insulate the sink from the chip. The more surface area of the chip that contacts the sink, the better.
Click to expand...
Click to collapse
Pardon?
Right now there probably isn't that much contact between the two.. as the hamburger patty of a thermal pad is gone.. so that needs to be shimmed. I swear the 'heatsink' is steel.. it just doesn't have that aluminum frailty to it.. I have some 2000 grit sandpaper if things go far enough to warrant a blingy looking 'lapping' of the heatsink. heh..
That seems like overkill, but good luck anyway, I am interested to see how it turns out!
californiarailroader said:
That seems like overkill, but good luck anyway, I am interested to see how it turns out!
Click to expand...
Click to collapse
My main reason for opening it up was to clear the crapload of dust bunnies hanging out in my camera lens. Then I went poking around, seeng what I could screw up.
Blades said:
Pardon?
Right now there probably isn't that much contact between the two.. as the hamburger patty of a thermal pad is gone.. so that needs to be shimmed. I swear the 'heatsink' is steel.. it just doesn't have that aluminum frailty to it.. I have some 2000 grit sandpaper if things go far enough to warrant a blingy looking 'lapping' of the heatsink. heh..
Click to expand...
Click to collapse
Think about the two surfaces at the microscopic level. The surfaces are rough. What we want is the maximum contact area between the two surfaces. The paste is used to fill in what does not contact. So it is better to have surface to surface contact than a thin layer of paste between the surfaces. That is one reason why there is usually a good deal of pressure applied between the surfaces.
BTW, be careful some heatsink paste is conductive!
Freelancerx said:
that looks like a lot of thermal paste for such a tiny chip
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Click to collapse
Yeah, that's way too much.
Um yeah, that is WAY too much paste. It should be common knowledge that too much paste will actually INCREASE the temperature. Quite possibly your problem right there.
A 120mm fan will cool that down.
I'm no expert on heat sink shims, but wouldn't a iron or steel shim be better as they dissipate heat better?
Of course that much thermal paste wont lower temps? Do you even know what you're doing?
The best way to apply thermal paste is to place a rice-sized dot into the surface, and let the pressure between the heatsink and the CPU naturally spread out the paste. Putting too much will make the temps go higher, not lower.
jjsoviet said:
The best way to apply thermal paste is to place a rice-sized dot into the surface, and let the pressure between the heatsink and the CPU naturally spread out the paste. Putting too much will make the temps go higher, not lower.
Click to expand...
Click to collapse
this
a pea sized/rice sized is enough even for a modern CPU let alone a tiny SoC which is about the size of a modern NB/SB of a computer
Mind sharing how you opened this up? There's some shiz on my camera lens too, and would like to clean it.
I kinda dropped mine (no scratches, cracks, damage, etc.) and the back panel popped up a little all around it, i managed to just push it down on all sides though.
jjsoviet said:
The best way to apply thermal paste is to place a rice-sized dot into the surface, and let the pressure between the heatsink and the CPU naturally spread out the paste. Putting too much will make the temps go higher, not lower.
Click to expand...
Click to collapse
SwiftLegend said:
Mind sharing how you opened this up? There's some shiz on my camera lens too, and would like to clean it.
I kinda dropped mine (no scratches, cracks, damage, etc.) and the back panel popped up a little all around it, i managed to just push it down on all sides though.
Click to expand...
Click to collapse
theres a sticky with a link to a teardown from an XDA remember IIRC
Edit: This is just a fun project. Every octa core phone throttles. That includes my S6. Its AnTuTu score from 5 back to back runs with similar 32C start ranges from 65K to 52K. That means a similar drop in performance. Also overheating & throttling are two very different things. Z3+ & S6 both throttle so that they don't get too hot (or 'overheat'). Glass backs on both don't help either, but I like them anyway. I was just trying to speed up the cooling process- not to cool down anything as the phone doesn't 'overheat' in the first place. You won't notice this throttling with regular usage & all these temperature numbers are for internal temp, not surface temp. I hope this clears up my intent. *End of Edit* 07/21/2015
This is probably the easiest way to decrease throttling during heavy CPU workload. All I had to do is insert few foil layers between the phone & TPU case. Attached picture shows plots from three scenarios - no case, just case, foil & case respectively. Oh, NFC will get blocked out by the foil. But I don't use it much anyway. Cheers.
#Reserved#
Very interesting thread, mate! It made my lazy as* to sign up just to post my results. Oh, I used this copper foil with a case. You won't need that much, btw lol
amazon dot com/Louis-Crafts-Copper-Foil-Inches/dp/B0042SWM98
My scores (normalized like yours) from 5 consecutive AnTuTu runs (& my initial temp was also a bit higher than yours)
Initial Temp (C) Score
0 34 100%
1 48.1 91.10%
2 49.1 86.86%
3 49.8 84.80%
4 50.1 83.00%
4K Test:
Outdoor-> 4 minutes in 96F / 35.5 degree Celsius weather (starting CPU temp was 37C as I was using few apps before the recording started )
Walked back home two minutes later and then
Indoor -> 9.5 minutes (CPU was still warm at 41C)
It really is the easiest fix ever for extreme users who use case anyway. Thanks!
nfs2010 said:
Oh, I used this copper foil with a case. You won't need that much, btw lol
Click to expand...
Click to collapse
That's freakin' awesome, dude :good: I never knew copper foil existed. Since I can't afford diamond foil, I'll go with copper I'll take the whole roll though as people are (primarily) using it for shielding their guitar pickups. Thanks a lot for your tip.
Have you guys considered the fact that the phone might, and let me say it again, MIGHT get hotter because we're in summer and it's seriously hot outside? I just checked the forecast for Austin TX, OP's town according to his info, and he has 37C over there. I think that MIIIIIIIIIIIIIIGHT have something to do with the phone getting hotter than usual.
Just saying.
schecter7 said:
This is probably the easiest way to decrease throttling during heavy CPU workload. All I had to do is insert few foil layers between the phone & TPU case. Attached picture shows plots from three scenarios - no case, just case, foil & case respectively. Oh, NFC will get blocked out by the foil. But I don't use it much anyway. Cheers.
Click to expand...
Click to collapse
What do you think about putting foil around the actual battery? Some people have suggested putting paper around it. Does anyone think either of those things are safe?
MarkMRL said:
Have you guys considered the fact that the phone might, and let me say it again, MIGHT get hotter because we're in summer and it's seriously hot outside? I just checked the forecast for Austin TX, OP's town according to his info, and he has 37C over there. I think that MIIIIIIIIIIIIIIGHT have something to do with the phone getting hotter than usual.
Just saying.
Click to expand...
Click to collapse
Yes, it's quite hot over here in ATX. I added an extra comment to my first post. I hope that makes things clear now.
pacattack81 said:
What do you think about putting foil around the actual battery? Some people have suggested putting paper around it. Does anyone think either of those things are safe?
Click to expand...
Click to collapse
The foil will short out the internal components and your phone may get toasted . Please DO NOT try it. But I really wanted to open the back and put some thermal compound like this one. I'll try it some day!
schecter7 said:
Yes, it's quite hot over here in ATX. I added an extra comment to my first post. I hope that makes things clear now.
The foil will short out the internal components and your phone may get toasted . Please DO NOT try it. But I really wanted to open the back and put some thermal compound like. I'll try it some day!
Click to expand...
Click to collapse
Thanks I was very close to trying it out. Funny you should mention the thermal compound...there's a guy on YouTube who opened up the nexus 5 and put some on the CPU and a little piece of metal
heat sink. I have the thermal compound but I don't have the piece of heatsink to test it out so I haven't tried it. One day I'm going to try it though as I have a nexus 5.
pacattack81 said:
Thanks I was very close to trying it out. Funny you should mention the thermal compound...there's a guy on YouTube who opened up the nexus 5 and put some on the CPU and a little piece of metal
heat sink. I have the thermal compound but I don't have the piece of heatsink to test it out so I haven't tried it. One day I'm going to try it though as I have a nexus 5.
Click to expand...
Click to collapse
That's great! You'll have better luck with the compound on the N5 as it has plastic back - I guess? On Z3+, I'll probably get bottle-necked by the glass back regardless of the internal enhancement. I could be wrong though if the heat sink goes all the way to metal side frame. It's certainly worth a shot.
As battery wrap, you'd probably want something that's thermally conductive AND electrically non-conductive.
schecter7 said:
That's great! You'll have better luck with the compound on the N5 as it has plastic back - I guess? On Z3+, I'll probably get bottle-necked by the glass back regardless of the internal enhancement. I could be wrong though if the heat sink goes all the way to metal side frame. It's certainly worth a shot.
As battery wrap, you'd probably want something that's thermally conductive AND electrically non-conductive.
Click to expand...
Click to collapse
Yea, there's got to be something you can wrap around a smartphone battery that could shield in the heat. I just bought an oppo find 7a and it has a removable back. Maybe some sort of insulation can be put on the inside back cover so your hands don't feel the heat when the phone heats up. Any ideas for either the battery and/or back cover? What's thermally conductive, but not electrically conductive?
---------- Post added at 09:28 PM ---------- Previous post was at 09:08 PM ----------
pacattack81 said:
Yea, there's got to be something you can wrap around a smartphone battery that could shield in the heat. I just bought an oppo find 7a and it has a removable back. Maybe some sort of insulation can be put on the inside back cover so your hands don't feel the heat when the phone heats up. Any ideas for either the battery and/or back cover? What's thermally conductive, but not electrically conductive?
Click to expand...
Click to collapse
I can't post links yet, but what about putting some cotton insulation inside the back case? I would think that might shield us from holding a hot phone. Also, what about reflective insulation tape? I think that might actually work. Thoughts?
pacattack81 said:
Yea, there's got to be something you can wrap around a smartphone battery that could shield in the heat. I just bought an oppo find 7a and it has a removable back. Maybe some sort of insulation can be put on the inside back cover so your hands don't feel the heat when the phone heats up. Any ideas for either the battery and/or back cover? What's thermally conductive, but not electrically conductive?
---------- Post added at 09:28 PM ---------- Previous post was at 09:08 PM ----------
I can't post links yet, but what about putting some cotton insulation inside the back case? I would think that might shield us from holding a hot phone. Also, what about reflective insulation tape? I think that might actually work. Thoughts?
Click to expand...
Click to collapse
Wait, we're not on the same page. I was trying to avoid throttling (not shielding the heat). Z3+ back side heats up where the CPU seats (very small spot somewhere underneath the top row of icons). The idea was to take that heat and spread it laterally over a bigger surface area to speed up the cooling process. Without the foil, I still don't feel the heat as my fingers don't touch that hot spot. The foil also indirectly reduces the hot feel from that tiny spot as the heat gets spread more uniformly.
But your case sounds different. You want to avoid the heat from the battery (or the CPU) ? Battery already has a pretty big surface area. And you probably don't want to keep the heat inside by using thermal insulators as that can be very harmful for the battery. You probably want to establish an even faster heat transfer to the environment so that equilibrium point can be maintained at a lower surface temperature. Is that right? A metal back cover can help in that case.
Also here are some electrical insulators that are thermally conductive - but I'm not quite sure about the availability of those
https://www.physicsforums.com/threa...ductive-thermally-conductive-material.125368/
schecter7 said:
Wait, we're not on the same page. I was trying to avoid throttling (not shielding the heat). Z3+ back side heats up where the CPU seats (very small spot somewhere underneath the top row of icons). The idea was to take that heat and spread it laterally over a bigger surface area to speed up the cooling process. Without the foil, I still don't feel the heat as my fingers don't touch that hot spot. The foil also indirectly reduces the hot feel from that tiny spot as the heat gets spread more uniformly.
But your case sounds different. You want to avoid the heat from the battery (or the CPU) ? Battery already has a pretty big surface area. And you probably don't want to keep the heat inside by using thermal insulators as that can be very harmful for the battery. You probably want to establish an even faster heat transfer to the environment so that equilibrium point can be maintained at a lower surface temperature. Is that right? A metal back cover can help in that case.
Also here are some electrical insulators that are thermally conductive - but I'm not quite sure about the availability of those :confused
Click to expand...
Click to collapse
I've tried TPU cases, but I still feel the heat. Maybe a metal case would be better. These look interesting.
amazon(dot)com/gp/aw/d/B00HNKD6A6/ref=pd_aw_sbs_107_1?refRID=1VRK3Q399HJZXA2GHWCJ
amazon(dot)com/gp/aw/d/B00L71LNS4/ref=pd_aw_sbs_107_1?refRID=1BQ362P6XMYRJET82TFG
pacattack81 said:
I've tried TPU cases, but I still feel the heat. Maybe a metal case would be better. These look interesting.
amazon(dot)com/gp/aw/d/B00HNKD6A6/ref=pd_aw_sbs_107_1?refRID=1VRK3Q399HJZXA2GHWCJ
amazon(dot)com/gp/aw/d/B00L71LNS4/ref=pd_aw_sbs_107_1?refRID=1BQ362P6XMYRJET82TFG
Click to expand...
Click to collapse
Interesting! So why does your battery heat up in the first place? Did you try to compare your battery temp (using CPU Z, etc) to others'? I thought battery only heats up during charging.
schecter7 said:
Edit: This is just a fun project. Every octa core phone throttles.
Click to expand...
Click to collapse
That was genius--thank you.
I've attached a heatsink with thermal paste (cheap one) to my nexus 4 once it didn't make a difference
too bad i sold it i can't try it with my Peltier (TEC)
and my note 4 here is cooler without my tough armor (ofc it is, that case is a monster) i think i bent my phone while taking it out will try it with foil as soon as i get one, hope it doesn't damage it :S
a copper plate would be better! or simply a thin heatsink
I tried this maybe a year ago, phone was a lot cooler but I lost my reception. I noticed this after few days, everyone thought something had happend because they couldn't reach me. I was busy gaming ?
Because the phone is opened from the back (http://www.witrigs.com/blog/sony-xperia-z4-teardown/) we should crowdfund a metal replacement made of aluminium but in the same glossy style and color the frame is and with a copper base which directly connects to the thermonuclear fusion core (aka Qualcomm) so that the heat is as best as possible transported from these to the whole backplate. The only difficulty will be the holes for the camera and LED light to be waterproof. And while we are at it, we could make the backplate a little bit ticker than the glass currently is so that the tiny height difference between the glass and the frame is gone too.
Ok, we can argue about the color and thickness but you get the idea. Should we do that? Once we got them funded we can sell them and get rich
an3k said:
Because the phone is opened from the back (http://www.witrigs.com/blog/sony-xperia-z4-teardown/) we should crowdfund a metal replacement made of aluminium but in the same glossy style and color the frame is and with a copper base which directly connects to the thermonuclear fusion core (aka Qualcomm) so that the heat is as best as possible transported from these to the whole backplate. The only difficulty will be the holes for the camera and LED light to be waterproof. And while we are at it, we could make the backplate a little bit ticker than the glass currently is so that the tiny height difference between the glass and the frame is gone too.
Ok, we can argue about the color and thickness but you get the idea. Should we do that? Once we got them funded we can sell them and get rich
Click to expand...
Click to collapse
That'd be excellent & throttling would probably be gone forever. I'm in But some dudes might mix up fast heat dissipation with 'overheating & throttling & battery drain' - all in one sentence The rear area that gets warm on Z3+ is actually very narrow & my fingers don't touch that part at all. But we've already seen a ridiculous amount of whining over that. Can you imagine the whining as we try to expand that dissipation area to get rid of throttling?
I think the thickness would be debatable as some may want to keep the slightly raised lips on the back to keep their phones from sliding around.
fredrik8 said:
I tried this maybe a year ago, phone was a lot cooler but I lost my reception. I noticed this after few days, everyone thought something had happend because they couldn't reach me. I was busy gaming
Click to expand...
Click to collapse
lol - good point. It depends on the antenna placement - I think. I didn't experience any difference in reception. I usually get 0-1 bar at home. So I really didn't have anything to lose in the first place lol
If you do this and have the phone on max brightness, does it auto-dim when loading xda's website?
Due to all the ads and issues with the website it always causes the screens brightness to throttle when loading, and then go back to full brightness afterwards.
(Try loading a couple of different topics when doing this)
Hi guys,
Just taken my N7 apart to replace a cracked screen for the first time ever, and noticed the only cooling the GPU gets is via the sticky foil which sinks the heat to the back of the screen? So, as I currently have it in pieces, is there any way I can instantly improve the cooling of the GPU, for example, would putting heatsink compound on the chip make any difference, etc?
Thanks in advance,
matheusl02
matheusl02 said:
Hi guys,
Just taken my N7 apart to replace a cracked screen for the first time ever, and noticed the only cooling the GPU gets is via the sticky foil which sinks the heat to the back of the screen? So, as I currently have it in pieces, is there any way I can instantly improve the cooling of the GPU, for example, would putting heatsink compound on the chip make any difference, etc?
Thanks in advance,
matheusl02
Click to expand...
Click to collapse
u can put thermal paste between foil and gpu then foil and back cover
Sent from my Nexus 7
Sorry for the noob question, but I have this new "core board" in the attached picture.
Do I just need to glue a heat sink to the silver part, obviously moving the cord out of the way?
Is it that simple, or are there certain spots to avoid?
I wonder if this drilled plate can be removed just to check its alignment to chip. Having just a fan above this (attached to HU's walls) might turn better solution.
ste2002 said:
I wonder if this drilled plate can be removed just to check its alignment to chip. Having just a fan above this (attached to HU's walls) might turn better solution.
Click to expand...
Click to collapse
So just remove the screws and see what is under there?
Yes. Some of us report that thermal paste is missing/no contact with plate etc. Such setup as in your photo - I've never seen yet though, but it is good to make sure the contact is properly arranged - then additional heatsink makes sense.
So if something is not touching the top part, a heat sink will do nothing?
I took the heat sink off mine. It did appear to have good contact with all the chips, but before replacing it, I spread the heatsink compound evenly across all the chips.
Then I added extra heatsinks on top with thermal adhesive, and added fan to top cover. See main heatsink thread for details, and read from beginning. Here's my post. https://forum.xda-developers.com/showpost.php?p=75274018&postcount=154
CadillacMike said:
So if something is not touching the top part, a heat sink will do nothing?
Click to expand...
Click to collapse
Even "better": it will block available vent holes. IMHO if there is no proper contact *and* no way it can be restored/arranged, then fan can do the cooling job via vent holes.
pwood999 said:
I took the heat sink off mine. It did appear to have good contact with all the chips, but before replacing it, I spread the heatsink compound evenly across all the chips.
Then I added extra heatsinks on top with thermal adhesive, and added fan to top cover. See main heatsink thread for details, and read from beginning. Here's my post. https://forum.xda-developers.com/showpost.php?p=75274018&postcount=154
Click to expand...
Click to collapse
It also acts to suppress RFI and acts as a heat spreader.
For my PX5 Android 6, I replaced the thermal compound on the heat spreader, added a heatsink and fan. Bonded using thermal adhesive, all parts repurposed from old laptop. Includes connectors, supply sourced from unit switched 5v which is powered off on sleep. Simple resistive voltage drop added results in cool temps and barely audible fan.
I have further modified the case top section to add a grill and filter medium.
ste2002 said:
I wonder if this drilled plate can be removed just to check its alignment to chip. Having just a fan above this (attached to HU's walls) might turn better solution.
Click to expand...
Click to collapse
Agree. Replace thermal compound and a fan either pulling hot air from or blowing cool air onto the SOM heat spreader and sourced externally should keep things cool.
I decided to run Cpu Throttling Test to measure how is the stock thermal performance of the phone and I noticed that it is rather lackluster. After about a minute and half of full cpu load(100 threads option in the program) the processor starts jumping around 800mhz and 1.2ghz, if the load is for a longer amount of time it would likely throttle down to 800mhz completely and keep in mind that this is with only the heat of the cpu, if you are doing something else that is stressing the gpu and storage as well it would throttle harder. Nowadays as you know galaxy s2 is often running on full load due to modern operation systems and apps being pretty heavy.
I had a look at pictures of the motherboard of the phone and instantly noticed a significant design flaw which is what causes the throttling-there is no heatsink over the soc at all. On the pic attached you can see the soc with another fairly big chip next to it(probably the baseband, idk).
I had some copper heatsinks left from a previous project so I decided to try adding them on top of the naked chips with some thermal paste. The size of the copper plates is 15x15mm, thickness 0.3mm.
So I disassembled the phone, removed the circle sticker from the soc, cleaned it and the chip next to it with some isopropyl alcohol then applied a tiny amount of thermal paste to the chips with a plastic spudger. Just a very thin coat. The next step is cleaning the copper heatsinks with isopropyl alcohol and sticking them on top of the chips. You only need to apply thermal paste to the chips, don't bother applying it to the copper heatsinks as well as if you put too much thermal paste and stick the chips it will likely cause a mess and get on the resistors and other components.
After that I applied a small amount of thermal paste to the plastic mid frame where chips would usually fit. Before that I cleaned the spot with a little isopropyl alcohol. I used a picture from ifixit teardown and drew with blue color on the spots where you should put the paste.
Well that is the mod. Now reassemble the phone.
Please keep track of the two little black screws that are securing the mainboard in place and be cautious around your volume and power button flex cables, as they are usually glued with weak adhesive to the plastic frame, so if you pull out the mainboard without wiggling them out of the adhesive first you might accidentaly rip them out or damage them.
And now, for the results. As last time, I did a full cpu load stress test with 100 threads. This time I waited the full 15 minutes and behold, the cpu didn't drop below 1.2ghz at all! This is insane improvement in thermal performance. The program says that the cpu thottled to 91% of the max performance, however that reading is due to the small inconsistency of the ''GIPS'' performance which is due to the difficulty of the load, rather than actual thermal throttling. As for the soc temperature, my rom doesn't seem to read it, I only get the battery temperature which was 35C after the 15 minute stress test. The 50C reading from the program is also wrong, it probably just lists it like that because it can't find a temperature reading for the cpu.
In reality even on stock speeds I feel that the phone runs smoother now. However, there is definitely plenty of room for overclocking now, easily to 1.4-1.6ghz. Unfortunately I'm using @rINanDO 's lineage os 14.1 with emulated storage(android 7.1.2) and there is no kernel with cpu overclock for that version, so I can't test that myself. Although I believe such a kernel will be very useful because this android version runs faster than android 9+ while still supporting nearly all apps.
So to sum it up, the benefits of this mod:
-thermal thottling completely removed
-lower temperatures mean less stress on the silicon and longer device lifespan, which is important as this model is already 11 years old
-plenty of thermal headroom for overclocking and significantly increased performance even on stock speeds
And the requirements for the mod:
-a screwdriver
-thermal paste, preferably non conductive
-two 15x15mm 0.3mm thickness copper heatsinks-I got mine from Aliexpress, a pack of 10 costed me 1.25$. They also come with a generic thermal grease but I don't recommend using it. I guess it will do the job if you don't have any other thermal paste.
-some isopropyl alcohol is also recommended for cleaning the surfaces, for better contact
-maybe a disassembly tutorial, anyway disassembling this phone is fairly easy. If you have no experience take your time
Unfortunately I didn't take pictures while doing the mod, so I hope the generic ifixit disassembly photos and my explanation are enough. The mod is pretty easy and took me around 30 minutes.
Informative
Tried it with alluminium instead (i cut 2 pieces from a pc cooler) and in android 12 it did throttle after 5 and a half min, but i undervolted it to 1175mv at 1200mhz and now it is throttling after 8min 45 sec, used arctic mx2 thermal paste. I didn t tested it before the mod, but i will try some games to see if alluminium really makes a difference. After the phone cools down i will try at 1300mhz, thx for the tutorial.